MUMBAI, India, Jan. 7 -- Intellectual Property India has published a patent application (202511104220 A) filed by Lovely Professional University, Phagwara, Punjab, on Oct. 29, 2025, for 'method for enhancing wheat growth, yield, and stress tolerance using silicon-chitosan biopolymeric formulation.'
Inventor(s) include Prachi Ganesh Pangerkar; Dr. Dipti Bisarya; Reena Rathore; and Dr. Vinai Kumar.
The application for the patent was published on Dec. 12, under issue no. 50/2025.
According to the abstract released by the Intellectual Property India: "A method (100) for enhancing wheat growth, yield, and stress tolerance through a Silicon-Chitosan biopolymeric formulation. The method involves dissolving Chitosan in acetic acid, dispersing Silicon, adjusting pH to 5-6.5, and adding a surfactant to form a stable solution. The formulation is applied to wheat plants via foliar or soil methods at critical growth stages, with concentrations of 25-100 mg Chitosan and 75-90 mg Silicon per 10 mL solution. Repeated applications and monitoring of plant physiological parameters ensure enhanced root development, antioxidant activity, nutrient absorption, and stress resilience. The method reduces reliance on chemical fertilizers and pesticides, improves grain yield and quality, and provides a sustainable, eco-friendly approach for wheat cultivation under normal and water-limited conditions."
Disclaimer: Curated by HT Syndication.
