MUMBAI, India, Aug. 29 -- Intellectual Property India has published a patent application (202517071985 A) filed by Huntsman Advanced Materials (SWITZERLAND) Gmbh, Basel, Switzerland, on July 29, for 'method for encapsulating electrical cells bearing a nickel-based surface.'
Inventor(s) include Schoenenberger, Catherine; Beisele, Christian; Colliard, Sophie; Cherkaoui, Zoubair; and Baron, Catherine.
The application for the patent was published on Aug. 29, under issue no. 35/2025.
According to the abstract released by the Intellectual Property India: "The present invention is directed to a method for encapsulating an article bearing a surface made of nickel, in particular an electrical component bearing a surface made of nickel, with a thermosetting polymer material as encapsulation material. The invention is also directed to kits of materials for encapsulating an article bearing a surface made of nickel and to articles resulting from the encapsulation. The method of the invention is based on application of a first coating based on a polymeric material of acrylic-based type between the article bearing a nickel-based surface and the encapsulation material."
The patent application was internationally filed on Feb. 08, 2024, under International application No.PCT/EP2024/053134.
Disclaimer: Curated by HT Syndication.
