MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517051130 A) filed by Saint-Gobain Placo, Courbevoie, France, on May 28, for 'method for checking the adhesion between layers of a construction panel, and corresponding device.'
Inventor(s) include Hervio, Valentine; Jaffel, Hamouda; Stanossek, Tilo; and Schultze, Andreas.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a device (40) for checking a bond between two layers of materials of a construction panel (9) formed by cutting, on a production line, a flow of layers of materials that are stacked and bonded together, so as to produce construction panels provided with edge surfaces, the checking device (40) comprising means for detecting a bonding defect between the two layers of materials, and being characterised in that the detection means comprise at least: - means (13) for capturing an image of an edge surface of the construction panel (9), and - means (7) for analysing the image thus captured."
The patent application was internationally filed on Oct. 31, 2023, under International application No.PCT/FR2023/051719.
Disclaimer: Curated by HT Syndication.
