MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202617013091 A) filed by Ceracon Gmbh, Weikersheim, Germany, on Feb. 6, for 'method and device for sealing and/or adhesively bonding a substrate.'
Inventor(s) include Kukla, Frank; Weiner, Heiko; and Hayn, Daniel.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "The invention relates to a method for sealing and/or adhesively bonding a substrate, the method comprising the following steps: a) providing a first substrate; b) applying a one-component thermally cross-linking polyurethane to the first substrate; c) providing a second substrate, wherein the first substrate, the second substrate and the polyurethane applied in step b) are pressed together, and cross-linking the polyurethane; and d) obtaining a sealed and/or adhesively bonded substrate, wherein the substrate is an electronic device, an electrical component, a housing, a printed circuit board, a semiconductor wafer, a bipolar cell, a fuel cell, a chip, a solar cell, a battery, a rechargeable battery, an electrolyser and/or a combination thereof. The invention also relates to a device for sealing and/or adhesively bonding a substrate and to the use of a one-component thermally cross-linking polyurethane as a sealant and/or adhesive for a substrate."
The patent application was internationally filed on Aug. 21, 2024, under International application No.PCT/EP2024/073480.
Disclaimer: Curated by HT Syndication.
