MUMBAI, India, Nov. 21 -- Intellectual Property India has published a patent application (202517097171 A) filed by Schunk Sonosystems Gmbh, Wettenberg, Germany, on Oct. 8, for 'method and device for electrically connecting a flexible printed circuit board to a metal element by means of ultrasonic welding.'
Inventor(s) include Hanika, Tim; and Keneder, Mathis.
The application for the patent was published on Nov. 21, under issue no. 47/2025.
According to the abstract released by the Intellectual Property India: "A method for electrically connecting a flexible printed circuit board (3) to a metal element (5) by means of ultrasonic welding and an ultrasonic welding device (1) which can be used to implement the method are described. The flexible printed circuit board has, in a connecting region (7), an electrically insulating, film-like substrate (9) and a metal layer (11) applied to the substrate. The method comprises: - applying the connecting region of the flexible printed circuit board to the metal element in such a manner that the metal layer is arranged in mechanical contact with the metal element, - applying an ultrasonic sonotrode (13) to the connecting region of the flexible printed circuit board in such a manner that a sonotrode surface (15) is arranged in mechanical contact with the film-like substrate, and - bringing about ultrasonic vibrations on the sonotrode surface. In order to ensure welding through the film-like substrate and, in the process, preferably not to damage the film-like substrate, different measures may be used."
The patent application was internationally filed on May 15, 2023, under International application No.PCT/EP2023/062920.
Disclaimer: Curated by HT Syndication.
