MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202517091550 A) filed by Saint-Gobain Centre De Recherches Et D'Etudes Europeen, Courbevoie, France, on Sept. 24, for 'metallurgical furnace monitored by electrical reflectometry.'
Inventor(s) include Champion, Thibault; Boinet, Mickael; and Sant, Jerome.
The application for the patent was published on Oct. 10, under issue no. 41/2025.
According to the abstract released by the Intellectual Property India: "The invention relates to a metallurgical furnace comprising a time- or frequency-domain electrical reflectometry monitoring device for monitoring the metallurgical furnace using an array of wire electromagnetic waveguides, wherein each waveguide comprises a measurement portion extending in parallel to the hot face and wherein the measurement portion is provided with a plurality of discontinuities, referred to as "base discontinuities", - which are distributed randomly at least along the measurement portion of the waveguide, and - are capable of generating echoes having an amplitude greater than 0.5%, preferably greater than 1% and less than 30%, of the amplitude of the back echo reflected by the output end of the waveguide, referred to as "base secondary echoes", or are formed by raised portions or by raised portions resulting from irregular segmentation of a dielectric material positioned between the first and second electrical conductors, or local variations in the distance between the first and second electrical conductors or in the distance between, on the one hand, the first electrical conductor and/or the second electrical conductor and, on the other hand, a dielectric material of a support, or variations in the structure and/or the composition of the environment surrounding the first and second electrical conductors or between the first and second electrical conductors, the number of base discontinuities, per metre of the measurement portion of the waveguide, being greater than 10."
The patent application was internationally filed on Mar. 29, 2024, under International application No.PCT/EP2024/058801.
Disclaimer: Curated by HT Syndication.
