MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517056481 A) filed by Dai Nippon Printing Co. Ltd., Tokyo, on June 12, for 'metal terminal adhesive film, production method therefor, metal terminal equipped with metal terminal adhesive film, power storage device external packaging material, kit comprising power storage device external packaging material and metal terminal adhesive film, power storage device, and production method therefor.'
Inventor(s) include Katou, Takahiro; Satake, Mizuki; Mizoshiri, Makoto; Kodani, Kazufumi; and Fujiwara, Ryo.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "A metal terminal adhesive film for interposition between a metal terminal that is electrically connected to an electrode of a power storage device element and a power storage device external packaging material that seals the power storage device element, said metal terminal adhesive film having at least a polypropylene layer, wherein when the island-in-sea structure of the polypropylene layer in a cross section extending in the thickness direction and the direction parallel to the TD is observed in a cross section image obtained using a scanning electron microscope, the ratio of the islands in the sea-island structure of the polypropylene layer is at most 20%."
The patent application was internationally filed on Nov. 27, 2023, under International application No.PCT/JP2023/042420.
Disclaimer: Curated by HT Syndication.
