Intellectual Property India Publishes Patent Application for 'Measurement Sensor For A Thermal Measurement Variable And Measurement Station Comprising Such A Measurement Sensor' Filed by Endress+Hauser Wetzer Gmbh+Co. KG

MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517029838 A) filed by Endress+Hauser Wetzer Gmbh+Co. KG, Nesselwang, Germany, on March 28, for 'measurement sensor for a thermal measurement variable and measurement station comprising such a measurement sensor.'

Inventor(s) include Schalles, Marc; Umkehrer, Alfred; Vrdoljak, Pavo; Wiedemann, Stephan; and Wolf, Georg.

The application for the patent was published on June 13, under issue no. 24/2025.

According to the abstract released by the Intellectual Property India: "A measurement sensor (1), for determining a temperature of a medium (M) in a container (2), comprises a sensor module and coupling element (7) comprising: a main body (8) having a contact surface (9) for contacting the container (2); a cylindrical sensor chamber (10) in the main body (8) for a sensor element (3, 5), wherein the longitudinal axis of said chamber is at a distance equal to at most four of the radii thereof from the contact surface, wherein intersection points of normal vectors (N) of the latter define a directrix (LK), wherein a distance vector (AM) between the latter and the longitudinal axis (L) of the sensor chamber (10) and a direction vector (RV) of the directrix (LK) at the intersection point of the directrix (LK) with the distance vector (AM) span a reference plane (RE) with an angle (a) of at least 25 with respect to the longitudinal axis (L) of the sensor chamber; wherein the sensor module comprises: a sensor element in the sensor chamber; a module base body at a distance from the sensor element; and a thermal bridge body extending in the sensor chamber between the sensor element and the module base body, wherein along the longitudinal axis of the sensor chamber, cross sections of the sensor chamber are larger than the cross sections of the thermal bridge body that are respectively coplanar therewith, the thermal bridge body being integrally bonded to the module base body, and wherein the latter is integrally bonded to the wall of the sensor chamber."

The patent application was internationally filed on Sept. 07, 2023, under International application No.PCT/EP2023/074660.

Disclaimer: Curated by HT Syndication.