MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517041437 A) filed by Hatch Ltd., Mississauga, Canada, on April 29, for 'low frequency pulse ultrasonic system and method for non-intrusive evaluation of multi-layered industrial structures.'
Inventor(s) include Sadri, Afshin.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "A system and method for measuring thicknesses of one or more thin layers in a multi-layered industrial structure. One of the layers may comprise a coarse- grained material. The multi-layered structure may be less than 600mm thick. The method comprises emitting ultrasonic pulses into the multi-layered industrial structure and detecting thickness frequencies of the layers of the structure and comparing against known thickness frequencies. The ultrasonic pulses being a frequency sweep pulse or a broadband frequency sweep pulse uniquely programmed for the multi-layered structure."
The patent application was internationally filed on Oct. 20, 2023, under International application No.PCT/CA2023/051401.
Disclaimer: Curated by HT Syndication.
