MUMBAI, India, Feb. 27 -- Intellectual Property India has published a patent application (202641019058 A) filed by Sri Krishna College Of Engineering And Technology, Coimbatore, Tamil Nadu, on Feb. 19, for 'low-carbon composite thermal insulation tile for energy-efficient building applications.'
Inventor(s) include Sakthivel R; Gokul Sibi M; Manikandan T; Rufus Boban; and Surendar D.
The application for the patent was published on Feb. 27, under issue no. 09/2026.
According to the abstract released by the Intellectual Property India: "The present invention discloses a sustainable thermal insulation tile comprising a unique composite of low-carbon and waste-derived materials. The tile includes a binder system of lime, Ground Granulated Blast Furnace Slag (GGBS), and fly ash; lightweight insulating fillers namely expanded perlite and cork granules; natural coir fibre as reinforcement; and M-sand as fine aggregate. The specific proportioned mix, when cast into moulds and cured, yields a lightweight tile with a porous microstructure that significantly reduces thermal conductivity to a range of 0.8-0.9 W/m K. The inclusion of coir fibre enhances crack resistance and durability. A sensor-based validation method using DHT11 and Arduino confirms the tile's superior surface temperature regulation under heat exposure compared to conventional tiles. This invention provides an energy-efficient building material that utilises industrial by-products and natural resources, contributing to reduced cooling loads and promoting green construction."
Disclaimer: Curated by HT Syndication.
