MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517043788 A) filed by Zhongtian Radio Frequency Cable Co. Ltd.; and Jiangsu Zhongtian Technology Co. Ltd., Jiangsu, China, on May 6, for 'leaky cable.'
Inventor(s) include Sha, Min; Xu, Bohua; Wang, Bin; Zhao, Ruijing; Liu, Fang; Xu, Zongming; and Song, Hao.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "The present application relates to the technical field of cables, and in particular to a leaky cable. The present application aims to solve the problem of poor structural stability of an outer conductor layer in a related leaky cable. According to the leaky cable in the present application, an outer conductor layer comprises a slot portion, a first connecting portion, and a second connecting portion; a first knurled pattern is provided on the first connecting portion in a rolling manner, a second knurled pattern is provided on the second connecting portion in a rolling manner, and a third knurled pattern is provided on the slot portion in a rolling manner; the first connecting portion and the second connecting portion are at least partially attached, and in the attached area, the crest of the first knurled pattern corresponds to the crest of the second knurled pattern, and the trough of the first knurled pattern corresponds to the trough of the second knurled pattern, so that the first connecting portion and the second connecting portion are not prone to loosening or separating after being lap-jointed, improving the structural stability of the outer conductor layer. In addition, the bending performance of the first connecting portion and the second connecting portion is smaller than that of the slot portion, so that circumferential torsional deformation of the leaky cable in the laying process is avoided, and thus the outer conductor layer has a relatively stable structure."
The patent application was internationally filed on Oct. 20, 2023, under International application No.PCT/CN2023/125754.
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