MUMBAI, India, Nov. 7 -- Intellectual Property India has published a patent application (202547096561 A) filed by Applied Materials, Inc., Santa Clara, U.S.A., on Oct. 7, for 'lamp housing braze improvement for semiconductor rapid thermal processing (rtp) chamber.'
Inventor(s) include Yang, Yao-Hung; Gadgil, Shantanu Rajiv; Rao, Kaushik; Le, Ngoc; and Olson, Jeffrey Donald.
The application for the patent was published on Nov. 7, under issue no. 45/2025.
According to the abstract released by the Intellectual Property India: "Embodiments of lamp housings for a process chamber are provided herein. In some embodiments, a lamp housing for a process chamber includes: a first plate having a plurality of first openings; a copper plate having a plurality of second openings; a plurality of tubes brazed via a braze alloy to the first plate at first ends of the plurality of tubes and brazed to the copper plate via the braze alloy at second ends of the plurality of tubes, wherein the plurality of tubes have central openings that are aligned with the plurality of first openings and the plurality of second openings, and wherein the braze alloy comprises a nickel containing alloy or a copper containing alloy, wherein the copper containing alloy does not include gold; and an annular jacket circumscribing the plurality of tubes and brazed to the first plate via the braze alloy."
The patent application was internationally filed on Mar. 08, 2024, under International application No.PCT/US2024/019045.
Disclaimer: Curated by HT Syndication.
