MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202517006588 A) filed by Jetcool Technologies Inc., Littleton, U.S.A., on Jan. 27, for 'internal recirculation cooling module.'
Inventor(s) include Haber, Ludwig C.; Boggio, Cameron; La Fosse, Andy; Fox, David; and Ballerstedt, Robert.
The application for the patent was published on June 6, under issue no. 23/2025.
According to the abstract released by the Intellectual Property India: "Improved cooling modules and methods are configured to recirculate the liquid coolant fluid inside the cooling modules so that the same liquid cooling fluid impinges the surfaces of the heat-generating electronic components (or cooling plates in thermal communication with the heat-generating electronic components) multiple times before exiting the cooling module, thereby allowing a given flow of coolant fluid to be re-used several times over. With each re-use of the coolant fluid, the flow rate demand drops, reducing infrastructure required to achieve higher performance in direct and indirect micro-convective impingement cooling applications."
The patent application was internationally filed on July 18, 2024, under International application No.PCT/US2024/038605.
Disclaimer: Curated by HT Syndication.
