MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202548081727 A) filed by Qualcomm Incorporated, San Diego, on Aug. 28, for 'inter-rat communication techniques.'
Inventor(s) include Xie, Ling; Santhanam, Arvind Vardarajan; Liu, Zhanyi; Wu, Yongle; Li, Yong; Mao, Jie; Hoover, Scott; Zhang, Xuqiang; Singh, Sumit Kumar; Bhawnani, Udayan; Zhu, Xianwei; Kim, Albert; and Kadavakuduru, Prem Swaroop.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "Enhanced inter-RAT communication operations are disclosed. In one aspect, a device may identify one or more trigger events for monitoring control signals of another network for inter-RAT procedures, such as monitoring for one or more synchronization signal blocks (SSBs). In another aspect, the device may perform a comparison of multiple SSBs. In another aspect, the device may identify one or more release conditions for releasing local settings data associated with a customized measurement gap. In another aspect, the device may send the local settings data to a server. In another aspect, the device may send an extended signaling message indicating a timing offset between network devices."
The patent application was internationally filed on Jan. 08, 2020, under International application No.PCT/CN2020/070875.
Disclaimer: Curated by HT Syndication.
