Intellectual Property India Publishes Patent Application for 'Integration Of Radio Frequency Front-End For Size Reduction And Improved Performance' Filed by Apple Inc.

MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517072614 A) filed by Apple Inc., Cupertino, U.S.A., on July 30, for 'integration of radio frequency front-end for size reduction and improved performance.'

Inventor(s) include Dalmia, Sidharth S.; Signoff, David M.; and Edwards, Jennifer M.

The application for the patent was published on Aug. 22, under issue no. 34/2025.

According to the abstract released by the Intellectual Property India: "A radio frequency package for an electronic device with a reduced size and improved performance is presented herein. The radio frequency package includes a front-end package, transceiver dies and at least one antenna array providing a wireless communication functionality for the radio frequency package. The front-end package includes a radio frequency front-end die and at least one power control die connected to an insulation film substrate via first connectors. Each of the transceiver dies is connected to the at least one antenna array using second connectors."

The patent application was internationally filed on Dec. 15, 2023, under International application No.PCT/US2023/084295.

Disclaimer: Curated by HT Syndication.