MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202517085401 A) filed by Nippon Steel Corporation, Tokyo, on Sept. 9, for 'hot-stamp molded body.'
Inventor(s) include Mori, Keitaro; Nishibata, Hitomi; and Suzuki, Toshiya.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "This hot-stamp molded body includes: a first region having a metal structure in which the martensite area ratio is 95% or more and the average aspect ratio of prior-austenite grains is 1.10 or less; and a second region having a metal structure in which the martensite area ratio is 95% or more and the average aspect ratio of prior-austenite grains is 2.00 or more. The average crystalline grain diameter G1 (m) of the prior-austenite grains in the first region and the average crystalline grain diameter G2 (m) of the prior-austenite grains in the second region satisfy [G1=15.0], [G2=25.0], and [G2-G1=3.0]. The tensile strength measured by a tensile test using a test piece taken from the first region is 1250-2540 MPa."
The patent application was internationally filed on Mar. 08, 2024, under International application No.PCT/JP2024/008984.
Disclaimer: Curated by HT Syndication.
