MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517050848 A) filed by Nippon Steel Corporation, Tokyo, on May 27, for 'hot-stamp molded body.'
Inventor(s) include Hayashida, Shota; Mitsunobu, Takuya; and Takebayashi, Hiroshi.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "Provided is a hot-stamp molded body characterized by comprising a steel base material and a plating layer disposed on a surface of the steel base material, wherein: the plating layer has a prescribed chemical composition; the average C concentration from the surface of the steel base material to 1 m in the depth direction is 0.25 mass% or less; the steel base material contains 90% or more of martensite in terms of area ratio; the adhesion amount of the plating layer is 60 g/m2 or more per one surface; and the hot-stamp molded body has a Vickers hardness is 400 HV or more."
The patent application was internationally filed on Aug. 24, 2023, under International application No.PCT/JP2023/030474.
Disclaimer: Curated by HT Syndication.
