MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517051281 A) filed by Nippon Steel Corporation, Tokyo, on May 28, for 'hot-stamp molded body.'
Inventor(s) include Hayashida, Shota; Mitsunobu, Takuya; and Takebayashi, Hiroshi.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "Provided is a hot-stamp molded body characterized by: comprising a steel base material and a plating layer disposed on the surface of the steel base material; the plating layer having a prescribed chemical composition; the average C concentration from the surface of the steel base material to a depth of 1 m in the thickness direction being 0.25 mass% or less; the steel base material containing 90% or more of martensite in terms of surface area ratio; the plating layer containing an ?-Zn phase; the amount of adhesion of the plating layer being 50 g/m2 or more per side; and having a Vickers hardness of 400 HV or more."
The patent application was internationally filed on Aug. 24, 2023, under International application No.PCT/JP2023/030411.
Disclaimer: Curated by HT Syndication.
