MUMBAI, India, Aug. 29 -- Intellectual Property India has published a patent application (202517075214 A) filed by Nippon Steel Corporation, Tokyo, on Aug. 7, for 'hot stamp molded body, and aluminum-plated steel sheet for hot stamping.'
Inventor(s) include Kusumi Kazuhisa; Fujita Soshi; Suzuki Yuki; Tabata Shinichiro; Irikawa Hideaki; and Eguchi Haruhiko.
The application for the patent was published on Aug. 29, under issue no. 35/2025.
According to the abstract released by the Intellectual Property India: "The present invention provides: a hot stamp molded body; and an aluminum-plated steel sheet for hot stamping, which can be used to produce this hot stamp molded body. This hot stamp molded body comprises: a steel sheet having a prescribed chemical composition; a diffusion layer disposed on the steel sheet; and an Fe-Al alloy layer disposed on the diffusion layer. The chemical composition of the diffusion layer contains, in terms of mass%, more than 0.5% and less than 20.0% of Al, more than 80.0% and less than 99.5% of Fe, and 0.0-15.0% of Si. The Cu concentration in the diffusion layer satisfies prescribed relational expressions (1) and (2). The average thickness of the diffusion layer satisfies prescribed relational expression (3). In addition, this aluminum-plated steel sheet for hot stamping comprises: a steel sheet having a prescribed chemical composition; an Fe-Al-Si alloy layer disposed on the steel sheet; and an Al-based plating layer disposed on the Fe-Al-Si alloy layer. The Cu content in the Fe-Al-Si alloy layer satisfies prescribed relational expression (4)."
The patent application was internationally filed on Feb. 14, 2024, under International application No.PCT/JP2024/005045.
Disclaimer: Curated by HT Syndication.
