MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517058837 A) filed by Nippon Steel Corporation, Tokyo, on June 19, for 'hot-stamp formed body.'
Inventor(s) include Mitsunobu, Takuya; Hayashida, Shota; and Takebayashi, Hiroshi.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "Provided is a hot-stamped molded article characterized by comprising a steel base material and a plating layer disposed on a surface of the steel base material, wherein: the plating layer has a prescribed chemical composition; the average C concentration from the surface of the steel base material to 1 m in the depth direction is 0.25 mass% or less; the steel base material contains 90% or more of martensite in terms of area ratio; the adhered amount of the plating layer is 30 g/m2 or more per one surface; the plating layer contains a Zn-containing phase comprising at least one of an ?-Zn phase, Fe-Zn-based intermetallic compound phase, and Mg-Zn-based intermetallic compound phase; and the hot-stamped molded article has a Vickers hardness of 400 HV or more."
The patent application was internationally filed on Aug. 24, 2023, under International application No.PCT/JP2023/030451.
Disclaimer: Curated by HT Syndication.
