MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202517078900 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on Aug. 20, for 'hinge assembly and electronic device comprising same.'
Inventor(s) include Kim, Jinwoo; Cho, Chongkun; and Jeong, Uyhyeon.
The application for the patent was published on Oct. 10, under issue no. 41/2025.
According to the abstract released by the Intellectual Property India: "In an embodiment, an electronic device may include a hinge assembly. The hinge assembly may comprise a hinge bracket, a shaft rotatably connected to the hinge bracket, an arm member connected to the shaft, a cam member inserted in the shaft, a pressing member which presses the cam member toward the arm member, and an arm bracket slidably connected to the arm member. The arm member may comprise a cam portion having a plurality of cam peaks formed along the circumference of a through-hole, a body portion to which the arm bracket is slidably connected, and a connection portion connecting the cam portion and the body portion. When seen in a direction perpendicular to the shaft, from among the plurality of cam peaks, a first cam peak may be positioned so that at least part thereof can be aligned with the connection portion."
The patent application was internationally filed on Mar. 22, 2024, under International application No.PCT/KR2024/003595.
Disclaimer: Curated by HT Syndication.
