MUMBAI, India, March 13 -- Intellectual Property India has published a patent application (202517123031 A) filed by Caihong Display Devices Co. Ltd., Shaanxi, China, on Dec. 5, 2025, for 'high-strength and low-creep overflow brick and design method therefor.'
Inventor(s) include Li, Menghu; Xu, Lihua; and Hu, Weidong.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "Provided are a high-strength and low-creep overflow brick and a design method therefor, which belong to the technical field of glass substrate manufacturing. A mature overflow brick for glass substrate manufacturing is used as a reference overflow brick, and design parameters of the reference overflow brick, design parameters of a target design overflow brick, and an overflow brick creep stress exponent are acquired; similarity relationships between the reference overflow brick and the design overflow brick are established, and a system of equations regarding a first height and a second height of an inlet cross-section of the design overflow brick is constructed; the similarity relationships and known parameters are utilized to obtain equivalent thicknesses, equivalent height base values and equivalent heights of the reference overflow brick and the design overflow brick; and then, on the basis of the known parameters, the support surface length and clamping cylinder maximum cylinder pressure of the design overflow brick are obtained, thereby completing the design of the high-strength and low-creep overflow brick."
Disclaimer: Curated by HT Syndication.
