MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202517065991 A) filed by Huhtamaki Flexible Packaging Germany Gmbh & Co. Kg, Ronsberg, Germany, on July 10, for 'high-barrier multipack containing individual low-barrier packs.'
Inventor(s) include Daelmans, Eddy; Schaftner, Markus; and Marz, Manfred.
The application for the patent was published on Oct. 10, under issue no. 41/2025.
According to the abstract released by the Intellectual Property India: "The invention relates to a thermally sterilizable packaging system (10) comprising an outer multipack (12) that surrounds an outer packaging area (14) in which at least two inner individual packs (16) are received. The multipack (12) is made of a first packaging layer material (18) which comprises at least one polymer layer (44, 48, 52, 54, 56). The individual packs (16) are made of a second packaging material (60) which differs from the first packaging material. One packaging material (18, 60) of the first and second packaging materials, as a high-barrier packaging material, has an oxygen permeability of less than 0.5 cm/(m d bar) and a water vapor permeability of less than 0.5 g/(m d), and the other packaging material (18, 60), as a low-barrier packaging material, has an oxygen permeability of more than 3 cm/(m d bar) and a water vapor permeability of more than 2 g/(m d). According to the invention, the first packaging material (18) has at least two polymer layers (44, 48, 52, 54, 56) and is the high-barrier packaging material, and the second packaging material (60) is a packaging layer material (60) with at least one polymer layer (62, 64, 66, 68) and is the low-barrier packaging material."
The patent application was internationally filed on Dec. 14, 2023, under International application No.PCT/EP2023/085759.
Disclaimer: Curated by HT Syndication.
