MUMBAI, India, Jan. 9 -- Intellectual Property India has published a patent application (202541134696 A) filed by Amity University, Hyderabad, Telangana, on Dec. 31, 2025, for 'heterogeneous integration platform for co-packaged optics using copper-to-copper hybrid bonding and through-silicon vias.'
Inventor(s) include Dr. Praveen Kumar Maduri; Vipin Kumar; and Diwakar Rai.
The application for the patent was published on Jan. 9, under issue no. 02/2026.
According to the abstract released by the Intellectual Property India: "The invention addresses the technical problem of bandwidth scaling limitations in conventional 2.5D interposer approaches, which achieve only 20-30 terabits per second due to parasitic inductance and interconnect density constraints. The invention provides a solution comprising copper-to-copper hybrid bonding at ultra-fine pitch (5-15 micrometers, optimized at 10 micrometers) combining photonic integrated circuit (108) and electronic integrated circuit (110) chiplets; through-silicon vias (116) with specified dimensions (2-10 micrometer diameter, 10-50 micrometer pitch) optimized for stress management to preserve optical signal integrity with minimum spacing ( 500 micrometers) from optical waveguides; and differentiated dual-zone thermal management system (120) maintaining base die (100) at 100 degrees Celsius plus-minus 2.5 degrees Celsius and optical modules at 100 degrees Celsius plus-minus 1.5 degrees Celsius. The invention results in system-level bandwidth density and power efficiency. FIG. 1 depicts the block diagram showing base die (100), chiplet stacks (102), bonding interface (114), through-silicon vias (116), and dual-zone thermal management (120-124)."
Disclaimer: Curated by HT Syndication.
