MUMBAI, India, May 29 -- Intellectual Property India has published a patent application (202641043699 A) filed by Dr. S. Sty Asankar; Mr. R. Udha Y Ajeev AN; Mr. P. Akash; and Mr. R. Vinodh, Chennai, Tamil Nadu, on April 6, for 'heat transfer analysis in copper clockwise double twisted duct.'
Inventor(s) include Dr. S. Siv Asankar; Mr. R. Udha Y Ajeev; Mr. P. Akash; and Mr. R. Vinodh.
The application for the patent was published on May 29, under issue no. 22/2026.
According to the abstract released by the Intellectual Property India: "This project focuses on improving heat transfer using a copper clockwise double twisted duct. In a normal straight duct, the fluid flows smoothly, which results in lower heat transfer. To overcome this, a twisted duct is used to create a swirling motion of the fluid. Due to this swirling effect, the fluid mixes properly and the contact between the fluid and the duct surface increases. This leads to better heat transfer. Copper is used as the material because it has high thermal conductivity, which further improves the performance. The experiment is carried out by measuring the inlet and outlet temperatures and analyzing important parameters like Reynolds number, Nusselt number, and heat transfer rate. From the results, it is observed that the twisted duct provides better heat transfer compared to a normal duct, even though there is a small increase in pressure drop. Overall, this project shows that a double twisted duct is a simple and effective method to enhance heat transfer in thermal systems."
Disclaimer: Curated by HT Syndication.
