MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202411008987 A) filed by The Hershey Company, Hershey, U.S.A., on Feb. 9, 2024, for 'heat-tolerant chocolate and the process of preparing the heat-tolerant chocolate thereof.'
Inventor(s) include Murali Krishnan; Kesava Reddy C; S Venkateswara Rao; Dipankar Biswas; Sudhakar Singh; and Doug Brown.
The application for the patent was published on Aug. 22, under issue no. 34/2025.
According to the abstract released by the Intellectual Property India: "A heat-tolerant chocolate and the process of preparing the heat-tolerant chocolate is disclosed. The process includes blending a sweetener, a thermal structuring component comprising anhydrous dextrose, optionally with milk component into a blend. Further, the confectioner fat component, emulsifying component and optionally cocoa component are mixed with the blend and refined to have a particle size of about 10-30 microns to form a refined mixture. The refined mixture then undergoes the steps of conching between 36-42 C, moulding and thereafter, curing at low temperatures ranging between 18-32 C to for a heat stable chocolate. The thermal structuring component preferably comprising anhydrous dextrose acts as a humectant and the temperatures and time employed at the conching and curing steps helps maintain the taste and texture at temperatures as well as heat stability at temperatures as high as 45 C without compromising on the structural stability."
Disclaimer: Curated by HT Syndication.
