MUMBAI, India, Aug. 8 -- Intellectual Property India has published a patent application (202411004408 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on Jan. 22, 2024, for 'heat operated workpiece joining device.'
Inventor(s) include Manpreet Singh.
The application for the patent was published on Aug. 8, under issue no. 32/2025.
According to the abstract released by the Intellectual Property India: "A heat operated workpiece joining device, comprising a rectangular shaped frame 1 developed to be installed on a first workpiece that user desire to join with a second workpiece, a pair of primary motorized clamping units 2 attached on frame 1 for gripping first workpiece, a slot 3 crafted on frame 1 for enabling user to place second workpiece, a laser sensor installed on frame 1 for detecting alignment of workpiece(s), a robotic link 6 attached with a pair of C-shaped member 7 attached on frame 1 for positioning member 7 around junction of workpiece(s), an artificial intelligence-based imaging unit 9 installed on frame 1 for determining successful accommodation of junction inside member 7 and actuates an electronic nozzle 10 to dispense highly inflammable solution inside member 7 and actuates an electric ignitor 12 to ignite solution to heat junction resulting in melting of junction, thus joining workpieces."
Disclaimer: Curated by HT Syndication.
