MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202514081134 A) filed by Nidec Mobility Corporation, Aichi, Japan, on Aug. 27, 2025, for 'heat dissipation member and power supply device.'
Inventor(s) include Yoshida, Yohei; and Kawakita, Yoichi.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "The heat dissipation member (1) includes a case (2) that covers the circuit board (4), a refrigerant flow path that is provided on an outer shell of the case (2) and is formed between an inlet (Cin) and an outlet (Cout), and a plurality of fins (11, 12, 13) that extend linearly along the refrigerant flow path, wherein the plurality of fins (11, 12, 13) are divided in the middle from the inlet (Cin) toward the outlet (Cout), and a fin pitch of the plurality of fins (11, 12, 13) disposed on the outlet (Cout) side is set to be larger than a fin pitch of the plurality of fins (11, 12, 13) disposed on the inlet (Cin) side."
Disclaimer: Curated by HT Syndication.
