MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202514081132 A) filed by Nidec Mobility Corporation, Aichi, Japan, on Aug. 27, 2025, for 'heat dissipation member and power supply device.'
Inventor(s) include Yoshida, Yohei; and Kawakita, Yoichi.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "The heat dissipation member (1) includes a circular case (2) covering the circuit board (4), a refrigerant flow path provided on an outer shell of the case and formed between an inlet (Cin) and an outlet (Cout), and a plurality of fins (11, 12, 13) extending linearly along the refrigerant flow path, and a plurality of ribs (14) for capturing the refrigerant traveling along an outer periphery of the case are provided from an upstream region to a downstream region on the outer periphery of the case."
Disclaimer: Curated by HT Syndication.
