MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517044993 A) filed by Nippon Steel Corporation, Tokyo, on May 9, for 'grain oriented electromagnetic steel sheet and production method therefor.'
Inventor(s) include Takahashi Masaru; Yasuda Masato; Morishige Nobusato; Wada Naoki; Iwaki Masataka; and Mogi Hisashi.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "This grain oriented electromagnetic steel sheet has a silicon steel sheet an oxide layer formed on the surface of the silicon steel sheet and comprising oxides of one or more of Mg Al and Si and an insulating coating layer formed on the surface of the oxide layer. Oxides of one or more of Mg Al and Si having a circle equivalent diameter of 0.1 3.0 ??m are present at a density of 0.010 0.200 particles/??m2 in a range of 5 ??m in the sheet thickness direction of the silicon steel sheet from the interface of the silicon steel sheet and the oxide layer flat crystal grains are present on the surface side of the silicon steel sheet the length of the grain boundaries of the flat crystal grains constituting the length of the interface of the silicon steel sheet and the oxide layer in a cross section in the sheet thickness direction is 50% or more and a plurality of instances of linear thermal strain extending in a direction forming an angle of 80?? 100?? with respect to the rolling direction in the surface of the silicon steel sheet are formed at intervals of 1.0 20.0 mm with respect to the rolling direction."
The patent application was internationally filed on Nov. 22, 2023, under International application No.PCT/JP2023/042040.
Disclaimer: Curated by HT Syndication.
