MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517050402 A) filed by Nippon Steel Corporation, Tokyo, on May 26, for 'grain-oriented electrical steel sheet and method for forming intermediate layer and insulating coating included in grainoriented electrical steel sheet.'
Inventor(s) include Takeda Kazutoshi; Takatani Shinsuke; Kataoka Takashi; and Kogakura Yuuki.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "Disclosed is a grain-oriented electrical steel sheet which comprises a base steel sheet, an intermediate layer that is disposed on the surface of the base steel sheet, and an insulating coating film that is disposed on the surface of the intermediate layer, wherein the intermediate layer has an average thickness of 20 nm to 200 nm, and contains one or more elements that are selected from the group consisting of V, Mo, W and Zr, while containing phosphorus, fluorine, and one or more elements that are selected from the group consisting of nitrogen and oxygen. Also disclosed is a method for forming an intermediate layer and an insulating coating film of this grain-oriented electrical steel sheet."
The patent application was internationally filed on Dec. 20, 2023, under International application No.PCT/JP2023/045617.
Disclaimer: Curated by HT Syndication.
