MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517051280 A) filed by Nippon Steel Corporation, Tokyo, on May 28, for 'grain-oriented electrical steel sheet and manufacturing method therefor.'
Inventor(s) include Takahashi Masaru; Yasuda Masato; Hamamura Hideyuki; Wada Naoki; Iwaki Masataka; and Mogi Hisashi.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "This grain-oriented electrical steel sheet has a silicon steel sheet, an oxide layer that is formed on a surface of the silicon steel sheet and comprises an oxide or oxides of one or more of Mg, Al, and Si, and an insulating film layer that is formed on the surface of the oxide layer. In the silicon steel sheet, in a range that is 10 m in the sheet thickness direction from the interface between the silicon steel sheet and the oxide layer, instances of the oxide or oxides of one or more of Mg, Al, and Si with an equivalent circle diameter of 0.1-3.0 m are present at a density of 0.010-0.200 instances/m2. On the surface side of the silicon steel sheet, there are flat crystal grains that have an average thickness of 0.5-5.0 m in the direction normal to the surface, have an aspect ratio of 1.5 or greater, said aspect ratio being the ratio of the grain width in a direction parallel to the surface to the average thickness, and have crystal orientations deviating by 10 or more from the Goss orientation. In a cross-section in the sheet thickness direction, the length of the grain boundaries of the flat crystal grains accounts for 70% or more of the length of the interface between the silicon steel sheet and the oxide layer."
The patent application was internationally filed on Nov. 22, 2023, under International application No.PCT/JP2023/042039.
Disclaimer: Curated by HT Syndication.
