MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202534032494 A) filed by Fosys Co. Ltd., Incheon, Republic of Korea, on April 2, for 'forming apparatus for semiconductor package lead.'
Inventor(s) include Lee, Hoon; and Hong, Ki Gon.
The application for the patent was published on Oct. 10, under issue no. 41/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to an improved semiconductor package lead forming apparatus in which an angular cam punch performs a reciprocating motion along an operation section and an inclined hole of a cap holder in an elastically supported state, such that the lead is bent against a forming die while forming pressure on the inclined package lead is maintained, and impact transmitted between the angular cam punch and the forming die is minimized during the bending process, thereby extending the lifespan of the angular cam punch and mold components, and ensuring product reliability even after prolonged use. The improved semiconductor package lead forming apparatus includes: an upper mold and a lower mold; a plurality of forming dies which are installed on the lower mold and on which a package is seated; a punch unit which is installed on the upper mold and has a punch fixing plate; a spacer which is elastically supported on the upper mold and the punch unit; a stripper plate which is installed opposite and spaced apart from the forming die; a shoulder clamp which is installed on the stripper plate to fix a body of the package; a cam holder which has an operation section of a hopper shape on both sides of the shoulder clamp; a roller punch which is installed on the punch fixing plate and arranged between the spacer and the operation section; and an angular cam punch which is elastically supported in the operation section and configured to bend leads of the package according to the operation of the roller punch."
Disclaimer: Curated by HT Syndication.
