MUMBAI, India, May 1 -- Intellectual Property India has published a patent application (202641045801 A) filed by National Institute Of Technology, Mangaluru, Karnataka, on April 9, for 'fabrication of copper-coated lightweight materials for advanced electrical and heat transfer applications.'
Inventor(s) include Rajasekaran Balasundaram; and Sreerag M P.
The application for the patent was published on May 1, under issue no. 18/2026.
According to the abstract released by the Intellectual Property India: "Fabrication of Copper-Coated Lightweight Materials for Advanced Electrical and Heat Transfer Applications A process for fabricating copper-coated lightweight materials for advanced electrical and heat transfer applications using HVAF process comprises selecting an aluminium substrate, followed by selecting OFHC copper powder with a particle size range of 15-38 microns. The powder is fed into HVAF gun using nitrogen gas, while a high-velocity flame is generated using LPG and compressed air. The powder particles undergo thermal softening and are accelerated to supersonic velocities at a traverse speed of 600 mm/s. Deposition is carried out at a standoff distance of 180 mm directly onto the unprepared aluminium substrate, with a powder feeder speed of 10 RPM and a raster scan step size of 2 mm. The coating achieves 3 mm thickness with 60% efficiency, exhibiting electrical conductivity of 75% and thermal conductivity of 80% of copper, improving to 93% IACS and 90% respectively after heat treatment at 500 C for 1 hour."
Disclaimer: Curated by HT Syndication.
