MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202421011181 A) filed by Tata Autocomp Systems Limited, Composites Division, Pune, Maharashtra, on Feb. 17, 2024, for 'epoxy based sheet moulding compound (smc) technology and a process for the same.'
Inventor(s) include Ghosh, Sajal Kumar; Mishra, Aswini Kumar; Patil, Dinesh; and Rane, Rahul.
The application for the patent was published on Aug. 22, under issue no. 34/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure relates to a novel epoxy based sheet moulding compound (SMC) designed and developed by mixing epoxy resins, novel curing systems, performance additives, mineral fillers and fiber reinforcements. The present disclosure addresses various challenges including high curing time (more than 30min@140-180 C), low shelf life (2-3 day when stored at or below 25 C), difficulty in release of part (mould sticking issue) and need of post-curing of moulded parts. The thickening chemistry associated with the conventional SMC technology involving unsaturated polyester and vinyl ester resins does not work with the epoxy-based SMC technology. This disclosure has successfully addressed all these issues and making Epoxy SMC technology a reality for mass production of Composite Materials and Parts without doing any major changes to the existing manufacturing set-ups. The epoxy moulded composite article fabricated by the compression moulding process exhibits higher mechanical strength and better heat resistance."
Disclaimer: Curated by HT Syndication.
