MUMBAI, India, Jan. 2 -- Intellectual Property India has published a patent application (202541125651 A) filed by B V Raju Institute Of Technology, Narsapur, Telangana, on Dec. 12, 2025, for 'enhanced bonding system for rcc structural joints using moisture-indexed silane primer and polymer-modified bond coat with objective readiness testing.'
Inventor(s) include Mr. S. J Shivaraj; Mr. Sourabh Varma; Ms. Gandham Gnanasaru Deepika; Ms. Nomula Preethi; and Mr. B. Mohan Krishna.
The application for the patent was published on Jan. 2, under issue no. 01/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to a field-deployable and cost-effective bonding system for RCC structural joints using moisture-indexed silane primers and polymer-modified bond coats with objective readiness testing. The system addresses cold joints in beam-column, slab-beam, and shear-wall interfaces through Droplet Absorption Index (DAI) moisture assessment (Dry 10s, Optimal-Damp 15-40s, Wet 40s), micro-etching (pH 2-4) for 2-3 primer penetration, and moisture-tuned silane application (200-500 g/m). Data from pull-off patch tests ( 40% residue = 2.5 MPa pass) and environment-adaptive timing tables ensures concrete placement readiness. The system achieves 10.2 MPa adhesion (4.4 conventional) and 5% seepage failure (14 improvement), analyzed via comprehensive QA documentation. This scalable solution provides continuous joint integrity monitoring for pharmaceutical plants, water structures, and industrial facilities, with alert mechanisms for readiness failures. The system ensures operator-independent consistency, preventive maintenance, and enhanced structural durability across diverse climates."
Disclaimer: Curated by HT Syndication.
