MUMBAI, India, Jan. 9 -- Intellectual Property India has published a patent application (202541133013 A) filed by Indian Institute Of Technology, Chennai, Tamil Nadu, on Dec. 29, 2025, for 'enclosure for water-proofing electronic components in underwater environments.'
Inventor(s) include Somayajula, Abhilash Sharma; Jayasankar, Prabhakaran; and Govindaraj, Aravindhyokesh.
The application for the patent was published on Jan. 9, under issue no. 02/2026.
According to the abstract released by the Intellectual Property India: "Disclosed is an enclosure (100) for water-proofing electronic components in underwater environments. The enclosure (100) includes a cylindrical casing (102) forming an enclosed compartment for housing the electronic components. Opposite ends of the cylindrical casing are sealing engaged with two end caps (104), each having an asymmetric cross-sectional geometry with increased material distribution toward the lower portion to enhance roll stability. A hybrid sealing assembly (106) is positioned at the interface between each end cap (104a, 104b) and the cylindrical casing 102. This assembly includes a primary seal (108) functioning as the active sealing element, supported by adjacent secondary seals (112). The hybrid sealing assembly (106) is embedded within a custom designed precision-machined groove in each end cap. The primary (108) seal is configured to face pressure directly, while the secondary seals (112) provide backup support, collectively ensuring watertight integrity across varying underwater depths."
Disclaimer: Curated by HT Syndication.
