MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517050989 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on May 27, for 'electronic device comprising structure for dispersing heat.'
Inventor(s) include Kang, Seunghoon; Kwon, Ohhyuck; Park, Yoonsun; Park, Jongkil; Sung, Jungoh; Son, Changjong; and Yun, Hajoong.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "An electronic device according to one embodiment may comprise: a printed circuit board; a processor on the printed circuit board; a vapor chamber which is spaced apart from the printed circuit board, and of which at least a portion is disposed on the processor; and a metal plate on the printed circuit board, including a seating groove accommodating at least a portion of the vapor chamber. The vapor chamber can include a plurality of pillars having flat ends. The plurality of pillars can include: a first set of pillars having a first pattern included in a portion of the vapor chamber; and a second set of pillars having a second pattern included in a different portion of the vapor chamber, the second pattern being different from the first pattern."
The patent application was internationally filed on Nov. 06, 2023, under International application No.PCT/KR2023/017696.
Disclaimer: Curated by HT Syndication.
