MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517042906 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on May 2, for 'electronic device comprising connector.'
Inventor(s) include Shim, Jongwan; Bae, Bumhee; Cheon, Jeongnam; and Choi, Junhwa.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "An electronic device comprises: a housing; and a connector disposed within the housing, wherein the connector includes: a case forming an outer surface of the connector and having an opening formed in at least a portion of the outer surface; and a printed circuit board disposed inside the case, the printed circuit board comprising a first layer having a plurality of first pins arranged thereon, a second layer having a plurality of second pins arranged thereon, and a ground layer disposed between the first layer and the second layer and disposed to maintain substantially a predetermined distance from the first layer or the second layer, wherein the plurality of first pins include at least one first ground pin, the plurality of second pins include at least one second ground pin, and the first ground pin and the second ground pin may be connected to each other through at least one via."
The patent application was internationally filed on Nov. 06, 2023, under International application No.PCT/KR2023/017679.
Disclaimer: Curated by HT Syndication.
