MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202537117988 A) filed by Thermocompact, Epagny-Metz-Tessy, France, on Nov. 27, 2025, for 'electrode wire and method for the production thereof.'
Inventor(s) include Ly, Michel; and Cadio, Pierro.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "An electrode wire (2) for electrical discharge machining comprises: - a metal core (10) comprising a peripheral face, the metal core being made of a single copper-zinc alloy, and - a zinc oxide layer (12) directly formed on the peripheral face of the metal core and covering this peripheral face, wherein the average thickness of the zinc oxide layer (12) is between 100 nm and 461 nm."
The patent application was internationally filed on May 13, 2024, under International application No.PCT/EP2024/063123.
Disclaimer: Curated by HT Syndication.
