MUMBAI, India, Nov. 7 -- Intellectual Property India has published a patent application (202544041206 A) filed by Te Connectivity Solutions Gmbh, Schaffhausen, Switzerland, on April 29, for 'electrically conductive contact assembly, module connector, connection assembly and method for mechanical fastening.'
Inventor(s) include Eheim, Manuel; Stine, Adrian; Heldmann, Frank; Wolf, Marcus; Hoffmann, Bjoern; Distler, Patrick; Buchholz, Ron; and Schaefer, Maik.
The application for the patent was published on Nov. 7, under issue no. 45/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to an electrically conductive contact assembly (100, 100', 100''), wherein the contact assembly (100, 100', 100'') comprises a contact element (106), a busbar (102) and a fastening element (110, 110', 110'') for mechanically fastening the contact element (106) to the busbar (102). The contact element (106) is configured to be affixed to the busbar (102) in a frictionally engaged manner at least on a first friction surface (120) in the receiving opening (104), and the fastening element (110, 110', 110'') comprises a knurled section (138) which is longer in the axial direction (A) or of the same length as the receiving opening (104) of the busbar (102). The knurled section (138) is configured such that the knurled section (138) in the assembled state of the contact assembly (100, 100', 100'') exerts a contact force (FK) upon the contact element (106) which presses the first friction surface (120) of the contact element (106) flatly against the inner side of the receiving opening (104) of the busbar (102). Furthermore, the present invention relates to a method for mechanically fastening a contact element (106) to a busbar (102)."
Disclaimer: Curated by HT Syndication.
