Intellectual Property India Publishes Patent Application for 'Electrical Junction Having An Improved Feedthrough Element' Filed by Micro Motion, Inc.

MUMBAI, India, Sept. 5 -- Intellectual Property India has published a patent application (202347052419 A) filed by Micro Motion, Inc., Boulder, U.S.A., on Aug. 4, 2023, for 'electrical junction having an improved feedthrough element.'

Inventor(s) include Shanahan, Shaun E.; Skinkle, David; James, Clayton T.; and Deshpande, Atul Vasant.

The application for the patent was published on Sept. 5, under issue no. 36/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to a feedthrough (200) adapted for use within a passage (300). The feedthrough (300) has a body (202) having a first interface region (204) and a second interface region (206). The first interface region (204) comprises a platform region (214). At least one electrical conductor (212) extends through the body (202) and out of the body (202) to both the first interface region (204) and the second interface region (206). A printed circuit board (216) is attached to the platform region (214). At least one pin hole (234) defined by the printed circuit board (216) is configured to accept the at least one electrical conductor (212)."

The patent application was internationally filed on Jan. 12, 2021, under International application No.PCT/US2021/013021.

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