MUMBAI, India, Sept. 5 -- Intellectual Property India has published a patent application (202144058124 A) filed by Te Connectivity Germany Gmbh, Bensheim, Germany, on Dec. 14, 2021, for 'electrical element, method of preparing an electrical element for a soldering step, and device for preparing an electrical element for a soldering step.'
Inventor(s) include Blumenschein, Rudi; Dressel, Andre Martin; Brabetz, Florian; and Greth, David.
The application for the patent was published on Sept. 5, under issue no. 36/2025.
According to the abstract released by the Intellectual Property India: "Shown is an electrical element (10), with two conducting elements (11) that are spaced from each other, and that are exposed at least partially by forming a recess (20) for receiving an electrical component (40), where in in the recess (20), a trough (30) for the electrical component (40) is formed and the trough (30) stretches from the one conducting element (11) to the other conducting element (11). Further shown is a method for preparing an electrical element (10) for a soldering step, in which a component (40) is soldered onto two conducting elements (11) of the electrical elements (10) that lie exposed in a recess (20) wherein in the recess (20) a trough (30) for the component (40) is formed into the element (10). Further, a corresponding device (90) for preparing an electrical element (10) for a soldering step is shown."
Disclaimer: Curated by HT Syndication.
