MUMBAI, India, June 27 -- Intellectual Property India has published a patent application (202517054450 A) filed by Ennovi Advanced Engineering Solutions Germany Gmbh, Heilbronn, Germany, on June 5, for 'electrical connection structure.'
Inventor(s) include Fleming, Bettina; Kuntz, Julio; and Neubauer, Michael.
The application for the patent was published on June 27, under issue no. 26/2025.
According to the abstract released by the Intellectual Property India: "The invention relates to an electrical connection structure (10) consisting of an flexible film (1) and at least one electrical conductor path (2), wherein the at least one electrical conductor path (2) is applied to a surface of the flexible film (1) in a protruding manner, preferably a conductive metal is printed directly onto the corresponding surface by means of a direct printing method, wherein the flexible film (1) is formed without a coating and/or covering in non-printed surface regions. The invention also relates to a method for producing the electrical connection structure (10)."
The patent application was internationally filed on Aug. 24, 2023, under International application No.PCT/EP2023/073284.
Disclaimer: Curated by HT Syndication.
