MUMBAI, India, Jan. 9 -- Intellectual Property India has published a patent application (202541132903 A) filed by R. M. K. Engineering College, Tiruvallur, Tamil Nadu, on Dec. 29, 2025, for 'eggshell empowerment: crafting eco-friendly prosthetic solutions.'
Inventor(s) include Savarna K; Vaishnavi D; Sushmitha B; Mohithaa N; Thangasakthi M; K. Chidambarathanu; S. Jhansi Ida; Anandaraj S; Jayaram B; and C. Mary Shiba.
The application for the patent was published on Jan. 9, under issue no. 02/2026.
According to the abstract released by the Intellectual Property India: "As the need for prosthetic devices rises, so does the need for more sustainable and environmentally friendly alternatives. Traditional prosthesis design and production frequently use ecologically unfriendly materials and procedures. However, with the rise of eco-friendly products, the sector is experiencing a move toward more sustainable methods. The objective of the present invention is to create a composite material that is biocompatible, lightweight, and long-lasting in order to provide prosthetic devices that are affordable and simple to manufacture and distribute, especially in developing nations."
Disclaimer: Curated by HT Syndication.
