MUMBAI, India, Aug. 29 -- Intellectual Property India has published a patent application (202517075697 A) filed by Shenzhen Shokz Co. Ltd., Guangdong, China, on Aug. 8, for 'ear-clip earphone.'
Inventor(s) include Zhong, Lei; Liu, Haochen; Yu, Shiyu; Xu, Jiang; Yuan, Weijie; and Wen, Xiaobang.
The application for the patent was published on Aug. 29, under issue no. 35/2025.
According to the abstract released by the Intellectual Property India: "An ear-clip earphone (10), which comprises: a sound-producing part (11), a contact part (12), and an ear hook (13). The ear hook (13) is configured to extend around the antihelix (105) and the helix (107) of a user, and connects the sound-producing part (11) and the contact part (12). The ear hook (13) has a first plane of symmetry (S1). A housing is projected on the first plane of symmetry (S1) to form a first projection (11'), the contact part (12) is projected on the first plane of symmetry (S1) to form a second projection (12'), and the ear hook (13) is projected on the first plane of symmetry (S1) to form a third projection (13'). A shortest connecting line (O1O2) or a common tangent point is provided between the first projection (11') and the second projection (12'). A midpoint of the shortest connecting line (O1O2) or the common tangent point is used as a first feature point (O), and a point on an inner contour curve of the third projection (13') farthest from the first feature point (O) is used as a second feature point (C). By designing the distance between the first feature point (O) and the second feature point (C), the ear hook (13) can extend around the ears of a larger proportion of users, and is suitable for users having different ear sizes. Meanwhile, the ear hook (13) has a suitable size, thereby preventing the problem of clamping not being secure."
The patent application was internationally filed on Feb. 06, 2024, under International application No.PCT/CN2024/076388.
Disclaimer: Curated by HT Syndication.
