MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202517130819 A) filed by Momentive Performance Materials Inc., Niskayuna, U.S.A., on Dec. 23, 2025, for 'dual cure adhesive composition.'
Inventor(s) include Dussaud, Anne; and Youngberg, Michael.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "An adhesive composition is shown and described herein. The composition comprises a silylated polyurethane, an epoxy functional compound, and an amine functional compound. The compositions are provided to control the molar ratio of amine active hydrogen (AH) to epoxy (E) groups. By controlling the amine active hydrogen to epoxy molar ratio, an adhesive with excellent adhesion and strength on a variety of types of substrates is provided."
The patent application was internationally filed on June 27, 2024, under International application No. PCT/US2024/035691.
Disclaimer: Curated by HT Syndication.
