MUMBAI, India, April 17 -- Intellectual Property India has published a patent application (202641042391 A) filed by Sr University, Warangal, Telangana, on April 2, for 'dual-conductive porous interlayer architecture using carbon-coated fibrous substrates for enhanced ion-electron transport in multilayer electrochemical devices.'
Inventor(s) include Dr. Manoranjan Ojha.
The application for the patent was published on April 17, under issue no. 16/2026.
According to the abstract released by the Intellectual Property India: "The present invention discloses a novel multilayer device architecture incorporating a dual-conductive porous interlayer composed of carbon-coated fibrous substrates, such as cellulose-based filter paper. The interlayer is fabricated by conformally coating a porous insulating scaffold with electrically conductive carbon, resulting in an interconnected network that simultaneously supports electron conduction and ion transport. The engineered interlayer exhibits a unique combination of properties including (i) high electronic conductivity arising from interconnected graphitic carbon domains, (ii) efficient ionic permeability enabled by intrinsic porosity of the fibrous matrix, and (iii) large internal surface area capable of hosting and temporarily storing electrolyte ions. This dual-conduction functionality allows the interlayer to operate as an ion reservoir, secondary current collector, and charge redistribution medium within the device. The invention further relates to the integration of such interlayers within multilayer electrochemical systems, wherein the interlayer is positioned between active electrodes and separators. The presence of the interlayer enhances charge propagation by facilitating deeper electrolyte penetration, reducing charge transfer resistance, and enabling more uniform ion flux across the electrode interfaces. This results in improved charge utilization, enhanced kinetics, and reduced polarization during operation. Additionally, the interlayer architecture allows modular stacking and thickness control, enabling optimization of device performance through tuning of diffusion pathways and conductive networks. The interlayer can be adapted for use in hybrid devices, integrated power systems, sensing platforms, and other electrochemical assemblies requiring efficient ion-electron coupling. The fabrication process is low-cost, scalable, and compatible with flexible substrates, making it suitable for large-area and portable device configurations. Accordingly, the present invention establishes a new design paradigm for incorporating multifunctional interlayers to enhance performance and efficiency in advanced electrochemical and electronic systems. Keywords Dual-conductive interlayer, Carbon-coated fibrous substrate, Porous electrochemical architecture, Ion-electron transport, Multilayer electrochemical devices, Charge transfer enhancement."
Disclaimer: Curated by HT Syndication.
