Intellectual Property India Publishes Patent Application for 'Display Substrate And Manufacturing Method Therefor, And Display Apparatus' Filed by Boe Technology Group Co. Ltd.; and Chongqing Boe Optoelectronics Technology Co. Ltd.

MUMBAI, India, Sept. 5 -- Intellectual Property India has published a patent application (202247050522 A) filed by Boe Technology Group Co. Ltd.; and Chongqing Boe Optoelectronics Technology Co. Ltd., Beijing, on Sept. 5, 2022, for 'display substrate and manufacturing method therefor, and display apparatus.'

Inventor(s) include Wang, Xiaolin; Fu, Pengcheng; Dong, Zhifu; Weng, Hongtao; Li, Zhiyong; and Wang, Wu.

The application for the patent was published on Sept. 5, under issue no. 36/2025.

According to the abstract released by the Intellectual Property India: "A display substrate and a manufacturing method therefor, and a display apparatus. The display substrate (100) comprises: a display area (AA) and a peripheral area (PA); and further comprises: a plurality of signal lines (DL), which are configured to provide signals for the display area (AA); a plurality of contact pads (P), which are configured to be electrically connected to the plurality of signal lines (DL); and at least two conductive connection lines (Z1, Z2), which are located on the side of the plurality of contact pads (P) that is away from the display area (AA), wherein the at least two conductive connection lines (Z1, Z2) comprise a first conductive connection line (Z1) that is closest to the plurality of contact pads (P) in a first direction (R1) pointing from the display area (AA) to the peripheral area (PA); and at least some of the plurality of contact pads (P) are located on a first conducting layer (ECL1), the first conductive connection line (Z1) is located on a second conducting layer (ECL2), and the first conducting layer (ECL1) and the second conducting layer (ECL2) are set to be different layers. The display substrate (100) can avoid a tip electric field forming between at least some of the contact pads (P) and the first conductive connection line (Z1), thereby preventing electrostatic discharge."

The patent application was internationally filed on Oct. 29, 2021, under International application No.PCT/CN2021/127628.

Disclaimer: Curated by HT Syndication.