MUMBAI, India, June 20 -- Intellectual Property India has published a patent application (202517032563 A) filed by Sika Technology Ag, Baar, Switzerland, on April 1, for 'digital analysis of heterogeneous materials.'
Inventor(s) include Velten, Ulf; and Weinkauf, Annette.
The application for the patent was published on June 20, under issue no. 25/2025.
According to the abstract released by the Intellectual Property India: "A computer-implemented method for characterization of a heterogeneous material comprising distributed constituents, especially particle-shaped constituents, dispersed within a continuous phase of condensed matter, comprises the steps of: a) Providing or selecting a sample of the heterogeneous material to be analyzed; b) Taking at least one digital image of the sample with a camera of a computer device, especially a mobile computer device, or a camera connected to a computer device, especially a mobile device and/or with the computer device read in at least one digital image that was pre-recorded with a standalone camera; c) Performing an image analysis, especially an imaging particle analysis, of the at least one digital image for extracting one or more of the following properties: a size parameter, especially a particle size parameter, a shape parameter, especially a particle shape parameter, a spatial distribution, an orientation parameter, especially a particle orientation parameter, a surface parameter, especially a particle surface parameter, a roughness parameter, especially a particle roughness parameter, a packing density, a segregation parameter, a color, and/or an area share of the constituents, especially of the particle-shaped constituents, identified by the image analysis in the at least one digital image; and/or an area share of the continuous phase identified by the image analysis in the at least one digital image; d) Making available the one or more of the properties extracted in step c) via a user interface, via a machine interface and/or on a data storage medium."
The patent application was internationally filed on Dec. 07, 2023, under International application No.PCT/EP2023/084814.
Disclaimer: Curated by HT Syndication.